■ Introduction
    "Laser Wafer Inspection Equipment" measures thickness,TTV, Bow and Warpage at the same time with micron (μm) accuracy. It combines precise algorithm and high precision, high stability lasers. It also has the benefits of non-contact, instant monitoring, continuous measuring and no radiation damage. The core technology development is based on the existing non-contact dual-laser inspection system (AI-UP's core patented technology), and uses the SECS specification. To combine real-time measurement values with ERP or MES system, it can contruct a real-time digital integration service platform. The measurable wafer sizes include: 2-inch (50mm), 4-inch (100mm), 6-inch (150mm), 8-inch (200mm) and 12-inch (300mm) wafers.

■ Applications
    - Wafer manufacturing
    - Wafer Foundry
    - Wafer Thinning
    - Wafer Packaging and Testing
    - Factory Automation

■ Technical Data

	AI-UP Laser Wafer Inspection Equipment
	The Laser Sensor
Accuracy (um)	0.2
Resolution (um)	±1
Measuring frequency (Hz)	10k
Display Resolution (μm)	1
Thickness (μm)	±2
TTV (μm)	±2
Warpage (mm)	≦ 20
	The High Precision XY Tablet
Move Range (mm)	300 X 300
Wafer Size (mm)	≦ 300
Repeatability (um)	±0.5
Position accuracy (um)	± 1.5
Protection class	IP65